Property | Data |
Thermal Conductitivy（W/m·K） | ≥170 |
Dielectric Strength （1MHz） | 8.8 |
Flexural Strength （MPa） | ＞300 |
Vickers Hardness （GPa） | 11 |
Modules of Elasticity (Young) （GPa） | ＞200 |
water absorption （%） | 0 |
Volume Resistivity （Ω·cm）20℃ | ＞1014 |
Volume Resistivity （Ω·cm）300℃ | 109 |
Volume Resistivity （Ω·cm）500℃ | 107 |
Thermal Expansion Cofficient （/℃） | 4-6×10-6 |
| Density （g/cm3） | ≥3.30 |
| powder purity | Metal impurity content≤0.05Wt%，oxygen content ≤1Wt%，carbon content≤0.05Wt% |
| Dielectric Strength (KV/mm) | 15-20 |
Aluminum Nitride Ceramic Components Application:
• Components for semiconductor equipment
• IC packaging
• Thermal module substrate
• High power transistor module substrate
• High frequency device substrate
• Exothermic insulation board for Thyristor Modules
• Semiconductor laser, fixed substrate for light emitting diode （LED)
• Hybrid integrated module, ignition device module
• Used in the sintering of structural ceramics
• AlN Crucible for Metal Melting & Electronic cigarettes
• Applied to luminous materials
• Applied to the substrate material
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Address |  |
TEL |  |
Mobile phone |  |
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| No.7, Xiangshi Building, Shifeng District, Zhuzhou City, Hunan Province, China. 412005 | +86-731-28101852 | +86 189 7335 9715 (whatsapp/wechat/skype) |
info@etopnm.com sales@etopnm.com |
